• State-of-the-art Class 10/100 cleanroom and lab space

  • 8” / 12”  silicon and 12″ glass wafer processing

  • Supports R&D, single/multi process run, prototyping to small volume fabrication with automated industry-ready tools

  • Full suite of fabrication tools

Lithography

  • ArF immersion scanner (>45 nm L/S)
  • KrF scanner (>110nm L/S)
  • GHI-line stepper (>0.8μm L/S)

Dry Etch/Dry Strip

  • Si/SiOx/a-Si high aspect ratio etch (up to 1:10)
  • SiN, III-V, Lithium Niobate etch
  • N2, O2, forming gas strip
  • Descum

Wet Etch/Cleans

  • Bench and single wafer frontside and backside particle cleans
  • Post-etch residue removal and PR strip
  • Cu, Ti, Si, oxide wet etch

Thin Films

  • PVD sputtering: Ti, TiN, Ta, TaN, Cu, Al, Ni, AlN, ScAlN, SiN
  • PVD evaporation: Au, Ti, Al, Ni, Cr
  • PECVD: Low-stress TEOS, SiOx, SiN, a-Si
  • ALD: TiN, HfOx, AlN, Al2O3, TiO2

Diffusion/Implant

  • LPCVD: SiN, N+ poly Si, LPTEOS
  • SiC, Ge, Si, SiGe epitaxy
  • B, P, Al, N ion implantation
  • Thermal oxidation (up to 1250 0°C)
  • Implant activation (up to 2000 0°C)

CMP

  • SiOx, SiN, Si
  • Cu, barrier

Electroplating

  • Cu TSV (high aspect ratio up to 1:15)
  • Cu damascene, RDL
  • Au, Ni, SnAg

Advanced Packaging

  • Wafer-to-wafer fusion/hybrid bonding (with overlay accuracy 3σ <100 nm)
  • Chip-to-wafer pick-and-place bonding
  • Si-Si, Si-glass temporary bonding and debonding
  • Mechanical dicing
  • Si, glass backgrinding

Metrology and Inspection

  • Micro and macro defect optical inspection
  • Defect review SEM with EDX
  • CDSEM, overlay metrology
  • 3D optical profiler
  • Surface roughness/morphology by 2D/3D AFM
  • Dielectric and metal thickness metrology
  • Confocal scanning acoustic microscopy
  • Optical probe station